ByteSnap Design showcases Industrial IoT engineering expertise and New BOM monitoring service at EDS 2025

Embedded electronics specialist ByteSnap Design will highlight its industrial IoT design and product lifecycle management expertise at the Engineering Design Show (EDS) 2025, stand H52.

The Birmingham-based consultancy will demonstrate its engineering contributions to the third-generation WAND Handheld Data Collector (HDC) – developed for Inductosense – and officially launch its new Obsolescence Management as a Service (OMaaS) offering.

These two projects showcase ByteSnap Design’s ability to deliver high-performance, future-ready embedded systems that help manufacturers solve complex challenges—from industrial sensing to component lifecycle management.

At EDS, ByteSnap Design will demonstrate the latest version of the WAND HDC, an innovative handheld pipe thickness monitoring device from Inductosense, a King’s Award for Innovation winner. While the product is owned and commercialised by Inductosense, ByteSnap Design was brought in to lead the embedded electronics and firmware redesign, enabling a major performance leap in the third-generation device.

ByteSnap’s redesign delivered dramatically improved operating speeds, lower unit cost, extended battery life, enhanced high-speed communications,a new, intuitive user interface and compliance with latest IoT cybersecurity standards.

“This project exemplifies the power of British engineering collaboration,” said Dunstan Power, Director at ByteSnap Design. 

“Working with Inductosense – a King’s Award winner at the absolute forefront of industrial sensing innovation – we’ve been able to apply our embedded systems expertise to enhance nearly every aspect of their already exceptional technology. From operating speed and battery life to cybersecurity compliance, this represents a classic improvement of an existing product using the latest technology to achieve maximum resilience and world-class performance.”

The third-generation WAND HDC retains Inductosense’s patented wireless ultrasonic sensing technology and non-invasive measurement capabilities, while benefiting from ByteSnap’s deep expertise in embedded Linux, ultra-low power design, and secure industrial communications.

In addition to showcasing its IoT engineering work, ByteSnap is launching Obsolescence Management as a Service (OMaaS) – a structured subscription solution designed to help manufacturers manage component lifecycle risks and avoid costly disruptions.

OMaaS gives technical directors visibility into component health across their product portfolio, offering proactive lifecycle tracking, change impact assessments, and strategic recommendations.

“Technical directors tell us the same story repeatedly: their factory emails about component status changes, pulling engineers away from innovation to investigate whether a parts notification actually matters,” said Dunstan Power. 

“Sometimes action is needed. Often, it’s noise. Either way, it consumes valuable technical leadership time that should be focused on next-generation development, not administrative parts checking.”

ByteSnap’s OMaaS workflow includes:

1.      Product Understanding – Reviewing schematics and BOMs to map risk

2.      Continuous Monitoring – Lifecycle tracking with distributor alerts

3.      Impact Assessment – ByteSnap investigates and escalates only meaningful issues

The service is ideal for teams managing legacy products, those affected by staff turnover, or any company seeking to shift from reactive BOM firefighting to strategic oversight.

In addition to hands-on demonstrations at stand H52, ByteSnap Director Dunstan Power will speak at EDS 2025 in two sessions. On 8 October, he will attend Breaking the Reactive Cycle: Strategic Approaches to Component Obsolescence Management and on 9 October he will speak on the Supply Chain Security Panel – discussing resilience in an era of tariffs and uncertainty.

To schedule a meeting or demo, contact info@bytesnap.co.uk or visit www.bytesnap.com. 

Image source: ByteSnap Design