Oxfordshire-based manufacturer of semiconductors, EnSilica, is set to report a record trading performance amid major contract wins and a fast-growing sales pipeline.
The Abingdon-headquartered business is a designer and supplier of mixed signal ASICs (application specific integrated circuit) which are tailor-made circuits or semiconductor chips developed for a particular use or product rather than for general purpose usage.
In a trading update, the company said it expects to announce results showing substantial trading growth over the prior year on all key metrics, a significantly enhanced balance sheet following an oversubscribed £10m equity fundraise in March 2026, and an expanded new business sales opportunities pipeline, up by £151.2m to £453.6m. Unaudited revenue in the year to 31 March increased by 51 per cent to £27.5m with EBITDA rising from nil to £4.7m.
The anticipated EBITDA of £4.7m exceeds guidance of £3.5-4.5m, enhanced by space-related grant income.
EnSilica chief executive Ian Lankshear said: “As these results show, we believe the business has moved to the next stage in becoming a leading, scalable platform in chip design and manufacturing within our specialist high-growth markets, especially the rapidly expanding Space and Communications sector. We have proven our capabilities in the marketplace and the £10m equity fundraise in March 2026 to strengthen our balance sheet has enabled the company to make material strategic progress, including securing two satellite contracts with the potential to unlock matched funding and a strategically important $75m auto contract.
“With the excellent contract conversion we enjoyed during FY26, the success of our model is increasingly evident, now with three chips poised to boost revenues by moving into supply production over the next 18 months. The company has never had a stronger pipeline of opportunity and management are now focused on evolving our repeatable IP into long-term revenue-generating chips which current and future customers will rely on for years to come.”
Image source: EnSilica
